Blar i SINTEF Open på forfatter "Ryningen, Birgit"
-
Capillary forces as a limiting factor for sawing of ultrathin silicon wafers by diamond multi-wire saw
Ryningen, Birgit; Tetlie, Pål; Johnsen, Sverre Gullikstad; Dalaker, Halvor (Peer reviewed; Journal article, 2020)Succeeding with ultrathin silicon wafer sawing by diamond multi-wire saw, is not only a matter of optimization; the challenges of thin wafer production and the capability limit have not yet been fully understood. In this ... -
Minority carrier lifetimes in Cz-Si wafers with intentional V-I transitions
Søndenå, Rune; Ryningen, Birgit; Juel, Mari (Peer reviewed; Journal article, 2017)A p-type Cz-Si crystal has been pulled with varying pulling speed in order to produce wafers containing two distinct regions; A region with silicon self-interstitial defects, and a vacancy dominated region. Band-to-band ...